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DISPARLON 6100

  • Market Application Adhesives
  • Application Advantage Anti-slump
  • Formulation Advantage Low activation temperature
  • Rheology modifier Powdered polyamide thixotropic agent requiring lowest activation temperature for anti-slump in sealants and adhesives. Especially suited for MMA/ MS polymer sealants.

DISPARLON 6200

  • Market Application Sealants
  • Application Advantage Anti-slump
  • Formulation Advantage Low activation temperature
  • Rheology modifier Powdered polyamide thixotropic agent requiring a low activation temperature for anti-slump in sealants and adhesives. Especially effective in MS polymer and epoxy systems.

DISPARLON 6250

  • Market Application Sealants
  • Application Advantage Anti-slump
  • Formulation Advantage Cost effective
  • Rheology modifier Cost effective powdered polyamide thixotropic agent requiring a low activation temperature for anti-slump in sealants and adhesives. Especially suited for MS sealant and silicone systems.

K-SPERSE 152

  • Market Application Solventborne
  • Application Advantage Pigment dispersion
  • Application Advantage Color development
  • Wetting/ dispersing agent General purpose. Very low use level. Synergist for competitive dispersants.

K-SPERSE 131

  • Application Advantage Faster dispersion times
  • Market Application Alkyds
  • Market Application Urethanes
  • Wetting/ dispersing agent Use in formulas containing driers or accelerators including alkyds, urethanes and epoxies.

K-SPERSE 152MS

  • Market Application Solventborne
  • Application Advantage Pigment dispersion
  • Application Advantage Color development
  • Dispersant Mineral Spirits version of K-SPERSE 152.

K-PURE CDI-4303

  • Chemistry Amino acid derivative
  • Formulation Advantage Compatibility
  • Application Advantage Hydrophobic
  • Corrosion inhibitor Corrosion inhibitor for solvent and solventless systems.

K-PURE CXC-1756

  • Chemistry Organometallic compound
  • Market Application 2K systems
  • Market Application Epoxy/ Anhydride
  • Catalyst (acid) An effective accelerator for thermal cure epoxy systems.

K-PURE CXC-1765

  • Chemistry Organometallic compound
  • Market Application Epoxy/ Anhydride
  • Market Application 2K systems
  • Catalyst (acid) A zinc complex catalyst for cross linking of epoxy/ carboxylic and epoxy/ anhydride functional resins.
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