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DISPARLON 6300

  • Market Application Epoxies
  • Formulation Advantage Heat stability
  • Formulation Advantage Low activation temperature
  • Rheology modifier Hybrid powdered polyamide thixotropic agent requiring a low activation temperature for excellent anti-sag. Especially effective in epoxy coatings and adhesives.

DISPARLON 6250

  • Market Application Sealants
  • Application Advantage Anti-slump
  • Formulation Advantage Cost effective
  • Rheology modifier Cost effective powdered polyamide thixotropic agent requiring a low activation temperature for anti-slump in sealants and adhesives. Especially suited for MS sealant and silicone systems.

DISPARLON 6200

  • Market Application Sealants
  • Application Advantage Anti-slump
  • Formulation Advantage Low activation temperature
  • Rheology modifier Powdered polyamide thixotropic agent requiring a low activation temperature for anti-slump in sealants and adhesives. Especially effective in MS polymer and epoxy systems.

DISPARLON 6100

  • Market Application Adhesives
  • Application Advantage Anti-slump
  • Formulation Advantage Low activation temperature
  • Rheology modifier Powdered polyamide thixotropic agent requiring lowest activation temperature for anti-slump in sealants and adhesives. Especially suited for MMA/ MS polymer sealants.

DISPARLON 6500

  • Application Advantage Non-seeding
  • Application Advantage Anti-sag
  • Application Advantage Shear thinning
  • Rheology modifier Versatile powdered polyamide thixotropic agent excellent anti-sag in coatings, sealants and adhesive formualations.

DISPARLON 6650

  • Market Application Epoxies
  • Application Advantage Anti-sag
  • Formulation Advantage Cost effective
  • Rheology modifier Cost effective powder polyamide based thixotrope that imparts excellent anti-sag properties and recoatability to coatings.

DISPARLON 6700

  • Market Application Heavy duty paints
  • Application Advantage Recoatability
  • Formulation Advantage Efficient
  • Rheology modifier Highly efficient powder polyamide thixotrope that imparts excellent anti-sag properties to coatings. Especially suited for high build epoxies.

DISPARLON A650-20X

  • Application Advantage High build films
  • Application Advantage Anti-sag
  • Formulation Advantage Efficient
  • Rheology modifier Pre-activated polyamide thixotrope, best for high build epoxy systems.

DISPARLON AQ-001

  • Market Application Waterborne
  • Application Advantage Anti-sag
  • Form Liquid
  • Rheology modifier Liquid acrylic associative thixotrope for waterborne systems that imparts strong anti-sag properties.

DISPARLON AQ-320

  • Market Application Waterborne
  • Application Advantage Pigment dispersion
  • % Active 100
  • Dispersant Solvent-free dispersing agent for aqueous systems with co-solvent.

DISPARLON AQ-330

  • Market Application Waterborne
  • Application Advantage Pigment dispersion
  • % Active 100
  • Dispersant Solvent-free dispersing agent for aqueous systems without co-solvent.

DISPARLON AQ-633E

  • Market Application Waterborne
  • Application Advantage Metallic orientation
  • Formulation Advantage Post addable
  • Rheology modifier Post-addable polyamide rheology control agent for metallic orientation.

DISPARLON AQ-7120

  • Market Application Waterborne
  • Application Advantage Wetting
  • Application Advantage Leveling
  • Surface control A wetting & leveling agent based on acrylic-silicone polymers and easily dispersed into waterborne systems with excellent recoatability.

DISPARLON AQ-870

  • Market Application Waterborne
  • Application Advantage Anti-settle
  • Formulation Advantage Post addable
  • Rheology modifier Liquid polyamide rheology control agent providing anti-sag and anti-settle for water reducible systems.

DISPARLON AQ-D400

  • Market Application Waterborne
  • Application Advantage Pigment dispersion
  • Application Advantage Gloss
  • Dispersant General purpose pigment wetting/ dispersing agent for waterborne dispersions and coatings.

DISPARLON AQH-800

  • Market Application Waterborne
  • Application Advantage Anti-settle
  • Formulation Advantage Post addable
  • Rheology modifier Post addable rheology control additive based on hybridized amide technology for waterborne systems.

DISPARLON AQH-810

  • Market Application Waterborne
  • Application Advantage Anti-settle
  • Formulation Advantage Post addable
  • Rheology modifier Post addable rheology control additive based on hybridized amide technology for waterborne systems.

DISPARLON OX-70

  • Market Application Epoxies
  • Market Application Urethanes
  • Application Advantage Defoaming
  • Surface control Defoaming and leveling for low polarity systems such as epoxy coatings.

K-CURE 1040

  • % Active 40
  • Formulation Advantage Unblocked
  • Application Advantage Fast cure
  • Catalyst (acid) Highest Gloss. Fast Cure. Excellent weathering and exterior durability.

K-CURE 1040W

  • % Active 40
  • Formulation Advantage Unblocked
  • Application Advantage Fast cure
  • Catalyst (acid) High quality p-TSA catalyst that is dissolved in water.

K-KAT XC-B221

  • Metal Type Bismuth carboxylate
  • % Active 20
  • Market Application 2K PU
  • Catalyst (tin-free) Designed for 2K and 1K blocked NCO urethane coatings. It provides similar properties to standard tin catalysts without the environmental drawbacks.

K-KAT XK-614

  • Metal Type Zinc-amine complex
  • % Active 100
  • Market Application Foam
  • Catalyst (tin-free) Recommended for ambient cure and force dry 2K SB and WB PU coatings. Has excellent stability in HFO-Blown PU foams. Can also be used in 1K moisture cure PU adhesives and coatings.

K-KAT XK-651

  • Metal Type Bismuth carboxylate
  • Market Application 2K PU
  • % Active 25
  • Catalyst (tin-free) High active, versatile, designed for 2K PU, HFO blown foam and silane terminated coatings. Improved hydrolytic stability compared to traditional Bi carboxylates.

NACURE 1051

  • % Active 50
  • Formulation Advantage Unblocked
  • Application Advantage Overbake resistance
  • Catalyst (acid) Catalysts providing best water & corrosion resistance. For high temperature applications.