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DISPARLON 6300

  • Market Application Epoxies
  • Formulation Advantage Heat stability
  • Formulation Advantage Low activation temperature
  • Rheology modifier Hybrid powdered polyamide thixotropic agent requiring a low activation temperature for excellent anti-sag. Especially effective in epoxy coatings and adhesives.

DISPARLON 6250

  • Market Application Sealants
  • Application Advantage Anti-slump
  • Formulation Advantage Cost effective
  • Rheology modifier Cost effective powdered polyamide thixotropic agent requiring a low activation temperature for anti-slump in sealants and adhesives. Especially suited for MS sealant and silicone systems.

DISPARLON 6200

  • Market Application Sealants
  • Application Advantage Anti-slump
  • Formulation Advantage Low activation temperature
  • Rheology modifier Powdered polyamide thixotropic agent requiring a low activation temperature for anti-slump in sealants and adhesives. Especially effective in MS polymer and epoxy systems.

DISPARLON 6100

  • Market Application Adhesives
  • Application Advantage Anti-slump
  • Formulation Advantage Low activation temperature
  • Rheology modifier Powdered polyamide thixotropic agent requiring lowest activation temperature for anti-slump in sealants and adhesives. Especially suited for MMA/ MS polymer sealants.

K-PURE CDR-3315

  • Chemistry Ester diol
  • Application Advantage Flexibility
  • Application Advantage Adhesion promotion
  • Resin modifier Modifier for aminoplast, isocyanate and cationically cured epoxies.

K-KAT 670

  • Metal Type Zinc complex
  • % Active 100
  • Market Application Polysiloxane
  • Catalyst (tin-free) Recommended for polysiloxane and STP 1K moisture cure adhesives, sealants, and coatings. Excellent cure response in both methoxy and ethoxy silane systems.

DISPARLON 6500

  • Application Advantage Non-seeding
  • Application Advantage Anti-sag
  • Application Advantage Shear thinning
  • Rheology modifier Versatile powdered polyamide thixotropic agent excellent anti-sag in coatings, sealants and adhesive formualations.

DISPARLON 6650

  • Market Application Epoxies
  • Application Advantage Anti-sag
  • Formulation Advantage Cost effective
  • Rheology modifier Cost effective powder polyamide based thixotrope that imparts excellent anti-sag properties and recoatability to coatings.

DISPARLON 6700

  • Market Application Heavy duty paints
  • Application Advantage Recoatability
  • Formulation Advantage Efficient
  • Rheology modifier Highly efficient powder polyamide thixotrope that imparts excellent anti-sag properties to coatings. Especially suited for high build epoxies.

DISPARLON A650-20X

  • Application Advantage High build films
  • Application Advantage Anti-sag
  • Formulation Advantage Efficient
  • Rheology modifier Pre-activated polyamide thixotrope, best for high build epoxy systems.

DISPARLON NS-30

  • Market Application Epoxies
  • Market Application Sealants
  • Application Advantage Anti-sag
  • Rheology modifier Anti-settle and anti-sag agent in paste form for solvent based coatings and adhesives.

DISPARLON P-466

  • Market Application Flooring
  • Market Application Urethanes
  • Application Advantage Defoaming
  • Surface control A strong silicone-free defoamer for urethane deck and roof coatings and high solids systems.

DISPARLON P-467

  • Market Application Flooring
  • Market Application Waterproofing
  • Application Advantage Defoaming
  • Surface control A strong silicone-free defoamer for urethane and polyaspartic floor coatings.

DISPARLON UVX-188

  • Market Application UV cured
  • Application Advantage Defoaming
  • Formulation Advantage Silicone-free
  • Surface control Defoaming additive for use in cationic epoxy based UV systems.

DISPARLON UVX-189

  • Market Application UV cured
  • Application Advantage Defoaming
  • Formulation Advantage Silicone-free
  • Surface control General purpose defoaming additive for use in cationic epoxy and acrylic based UV systems.

DISPARLON UVX-36

  • Market Application UV cured
  • Application Advantage Leveling
  • Application Advantage Anti-cratering
  • Surface control Leveling additive for use in acrylic UV systems.

K-PURE CXC-1612

  • Chemistry Quarternary ammonium blocked super acid catalyst
  • Market Application Epoxies
  • Application Advantage Low temperature cure
  • Catalyst (acid) An super acid based catalyst for epoxy homopolymerization and copolymerization with alcohol, vinyl ether ad oxetane.

K-PURE CXC-1614

  • Chemistry Quarternary ammonium blocked super acid catalyst
  • Market Application Epoxies
  • Application Advantage Fast cure response
  • Catalyst (acid) A blocked acid catalyst based on a super acid.

K-PURE CXC-1756

  • Chemistry Organometallic compound
  • Market Application 2K systems
  • Market Application Epoxy/ Anhydride
  • Catalyst (acid) An effective accelerator for thermal cure epoxy systems.

K-PURE CXC-1765

  • Chemistry Organometallic compound
  • Market Application Epoxy/ Anhydride
  • Market Application 2K systems
  • Catalyst (acid) A zinc complex catalyst for cross linking of epoxy/ carboxylic and epoxy/ anhydride functional resins.

K-PURE TAG-2678

  • Chemistry Quarternary ammonium blocked super acid catalyst
  • Application Advantage Low trace metals
  • Formulation Advantage No volatile by-products after activation
  • Thermal acid generator A quaternary ammonium blocked triflic acid thermal acid generator specifically designed for use in thermally cured microlithography coatings.

K-PURE TAG-2689

  • Chemistry Quarternary ammonium blocked super acid catalyst
  • Application Advantage Low trace metals
  • Formulation Advantage No volatile by-products after activation
  • Thermal acid generator A quaternary ammonium blocked triflic acid thermal acid generator specifically designed for use in thermally cured microlithography coatings.

NAMLON T-205

  • Market Application Solventbased paints
  • Market Application Sealants
  • Market Application Epoxies
  • Anti-sagging/ anti-settling additive for paints, flow additive for powder coatings.
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