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DISPARLON 6300

  • Market Application Epoxies
  • Formulation Advantage Heat stability
  • Formulation Advantage Low activation temperature
  • Rheology modifier Hybrid powdered polyamide thixotropic agent requiring a low activation temperature for excellent anti-sag. Especially effective in epoxy coatings and adhesives.

K-PURE CDR-3315

  • Chemistry Ester diol
  • Application Advantage Flexibility
  • Application Advantage Adhesion promotion
  • Resin modifier Modifier for aminoplast, isocyanate and cationically cured epoxies.

DISPARLON 4200-10A

  • Market Application General industrial
  • Application Advantage Metallic orientation
  • Formulation Advantage Post addable
  • Rheology modifier Flowable paste thixotropic agent that prevents pigment settling and hard-caking, while providing excellent metallic orientation.

DISPARLON 6650

  • Market Application Epoxies
  • Application Advantage Anti-sag
  • Formulation Advantage Cost effective
  • Rheology modifier Cost effective powder polyamide based thixotrope that imparts excellent anti-sag properties and recoatability to coatings.

DISPARLON 6500

  • Application Advantage Non-seeding
  • Application Advantage Anti-sag
  • Application Advantage Shear thinning
  • Rheology modifier Versatile powdered polyamide thixotropic agent excellent anti-sag in coatings, sealants and adhesive formualations.

DISPARLON 6700

  • Market Application Heavy duty paints
  • Application Advantage Recoatability
  • Formulation Advantage Efficient
  • Rheology modifier Highly efficient powder polyamide thixotrope that imparts excellent anti-sag properties to coatings. Especially suited for high build epoxies.

DISPARLON 6900-20X

  • Market Application Solventborne
  • Form Paste
  • Application Advantage Highly shear thinning
  • Rheology modifier Versatile thixotropic agent in paste form.

DISPARLON A650-20X

  • Application Advantage High build films
  • Application Advantage Anti-sag
  • Formulation Advantage Efficient
  • Rheology modifier Pre-activated polyamide thixotrope, best for high build epoxy systems.

DISPARLON BB-102

  • Formulation Advantage Pre-activated
  • Formulation Advantage Post addable
  • Formulation Advantage HAPS free
  • Rheology modifier Post addable, HAPS free polyamide thixotrope with easy incorporation.

DISPARLON EZ-777

  • Market Application Solventborne
  • Formulation Advantage Easy to use
  • Formulation Advantage Post addable
  • Rheology modifier Easily dispersible synthetic amide wax for strong thixotropic effect in a variety of solventborne systems.

DISPARLON PFA-231

  • Market Application Auto OEM
  • Formulation Advantage HAPS free
  • Application Advantage Anti-settle
  • Rheology modifier Pre-activated polyamide thixotrope for anti-settling and anti-sag properties. HAPS free version of 6900-20X.

K-PURE CXC-1756

  • Chemistry Organometallic compound
  • Market Application 2K systems
  • Market Application Epoxy/ Anhydride
  • Catalyst (acid) An effective accelerator for thermal cure epoxy systems.

K-PURE CXC-1765

  • Chemistry Organometallic compound
  • Market Application Epoxy/ Anhydride
  • Market Application 2K systems
  • Catalyst (acid) A zinc complex catalyst for cross linking of epoxy/ carboxylic and epoxy/ anhydride functional resins.

K-PURE TAG-2678

  • Chemistry Quarternary ammonium blocked super acid catalyst
  • Application Advantage Low trace metals
  • Formulation Advantage No volatile by-products after activation
  • Thermal acid generator A quaternary ammonium blocked triflic acid thermal acid generator specifically designed for use in thermally cured microlithography coatings.

K-PURE TAG-2689

  • Chemistry Quarternary ammonium blocked super acid catalyst
  • Application Advantage Low trace metals
  • Formulation Advantage No volatile by-products after activation
  • Thermal acid generator A quaternary ammonium blocked triflic acid thermal acid generator specifically designed for use in thermally cured microlithography coatings.
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